Taiwan IC Packaging Corporation
TWO: 3372.TWO0.00 n/a
+0.00%(+0.00)
Key facts
- Exchange
- Taipei Exchange
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Chung-Ho Tseng
- Employees
- 435
- Headquarters
- Kaohsiung, Taiwan
- IPO year
- 2007
- Market cap
- NT$3.5B
- Website
- https://www.ticp.com.tw
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Loading profile data…Frequently asked questions about 3372
What does Taiwan IC Packaging Corporation (3372.TWO) do?
Taiwan IC Packaging Corporation develops optical and ultrathin IC package technologies. The company's products include thin small outline, small outline, SSOP/TSSOP, quad flat no lead/dual flat no lead, thin PKG, TQFP, quad flat, LQFP, thermal enhanced, and image sensor packages. It also offers substrate-based package products, such as LGA, VLGA...
Where does 3372.TWO trade?
Taiwan IC Packaging Corporation (3372.TWO) trades on the Taipei Exchange.
What sector is 3372.TWO in?
Taiwan IC Packaging Corporation (3372.TWO) operates in the Technology sector, specifically in the Semiconductors industry.
Who is the CEO of Taiwan IC Packaging Corporation?
Chung-Ho Tseng is the chief executive officer of Taiwan IC Packaging Corporation (3372.TWO).
Where is Taiwan IC Packaging Corporation headquartered?
Taiwan IC Packaging Corporation is headquartered in Taiwan.
Does 3372.TWO pay a dividend?
Taiwan IC Packaging Corporation (3372.TWO) does not currently pay a regular dividend. Check the dividends tab for any historical or special distributions.
When did 3372.TWO go public?
Taiwan IC Packaging Corporation (3372.TWO) completed its initial public offering in 2007.