Chipbond Technology Corporation
TWO: 6147.TWO0.00 n/a
+0.00%(+0.00)
Key facts
- Exchange
- Taipei Exchange
- Sector
- Technology
- Industry
- Semiconductors
- CEO
- Huoo-Wen Gau
- Employees
- 5,630
- Headquarters
- Hsinchu City, Taiwan
- IPO year
- 2007
- Market cap
- NT$147.4B
- Website
- https://www.chipbond.com.tw
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What does Chipbond Technology Corporation (6147.TWO) do?
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturin...
Where does 6147.TWO trade?
Chipbond Technology Corporation (6147.TWO) trades on the Taipei Exchange.
What sector is 6147.TWO in?
Chipbond Technology Corporation (6147.TWO) operates in the Technology sector, specifically in the Semiconductors industry.
Who is the CEO of Chipbond Technology Corporation?
Huoo-Wen Gau is the chief executive officer of Chipbond Technology Corporation (6147.TWO).
Where is Chipbond Technology Corporation headquartered?
Chipbond Technology Corporation is headquartered in Taiwan.
Does 6147.TWO pay a dividend?
Yes — Chipbond Technology Corporation (6147.TWO) paid a trailing twelve-month dividend of TWD 3.75 per share. Frequency and ex-dividend dates are tracked on the dividends tab.
When did 6147.TWO go public?
Chipbond Technology Corporation (6147.TWO) completed its initial public offering in 2007.